• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for mounting semiconductor chips (2) provided with bumps (1) as flip chips (3) on substrate locations of a substrate (11). The method comprises placing a flip chip (3) in a fixedly arranged cavity (18), where the bumps (1) are wetted with flux and the position of the flip chip (3) is determined by means of a camera (14). The method further includes using a transport head (8) and a bondhead (10) that enable fast and highly accurate assembly.
    公开号:CH711536B1
    申请号:CH01404/15
    申请日:2015-09-28
    公开日:2019-02-15
    发明作者:speer Florian
    申请人:Besi Switzerland Ag；
    IPC主号:
    专利说明:

    description
    TECHNICAL FIELD The invention relates to a method for the assembly of semiconductor chips provided with bumps as a flip chip on substrate locations of a substrate.
    BRIEF DESCRIPTION OF THE INVENTION The object of the invention is to develop a method for mounting semiconductor chips as a flip chip on a substrate, which enables extremely high placement accuracy on the one hand and the highest possible throughput on the other hand.
    The stated object is achieved according to the invention by the features of claim 1. Advantageous embodiments result from the dependent claims.
    The invention is explained below using an exemplary embodiment and with reference to the drawing. The figures are schematic and are not drawn to scale.
    Description of the Figures
    1 shows schematically and in side view a device for the assembly of bumped semiconductor chips as a flip chip,
    Fig. 2 shows a camera carrier in supervision, and
    3 shows a pixel coordinate system and a machine coordinate system.
    DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows schematically and in a side view a device for the assembly of semiconductor chips 2 provided with bumps 1 as a flip chip 3, which is set up for carrying out the method according to the invention. The device comprises a wafer table 4 for the provision of the semiconductor chips 2, a flip device 5 with a pickup head 6, a first transport system 7 with a transport head 8, a second transport system 9 with a bond head 10, and a transport system (not shown) for the feed and provision of substrates 11 on a support 12, a device 13 for wetting the semiconductor chips with flux, a first camera 14 and a second camera
    15. The device 13 comprises a camera carrier 16, a plate 17 with a cavity 18, the bottom of which is transparent, and a flux container 19 open at the bottom. The position of the bonding head 10 is described by machine coordinates. The device is controlled by a control device, not shown.
    The first transport system 7 is set up to move the transport head 8 in at least two spatial directions. The second transport system 9 is set up to move the bonding head 10 in three spatial directions.
    In another, also suitable for carrying out the inventive method, the wafer table 4 and the flip device 5 with the pick-up head 6 are not available, but replaced by a feeder (also called "feeder"), which the Provides semiconductor chips 2 directly as flip chips 3. In such a device, the element shown in FIG. 1 with the reference numeral 4 represents the feeding device.
    The camera carrier 16 is arranged stationary on the device and comprises a bottom 20 on which the first camera 14 is fastened, and at least two side walls 21. The plate 17 is detachably mounted on the camera carrier 16. 2 shows the camera carrier 16 in supervision. The camera carrier 16 comprises a first optical marking 22 and, optionally, at least one further optical marking 23. The camera carrier 16 is mechanically rigid, such that the first camera 14 and the optical marking (s) 22 and optionally 23 in have a rigid geometric relationship to one another, so that the position and orientation of the pixel coordinate system assigned to the images of the first camera 14 are in a fixed, ie here assumed to be unchangeable, referring to the position of the optical marking (s) 22 and possibly 23.
    The optical marker (s) 22 and optionally 23 are preferably arranged in a direction perpendicular to the surface of the support 12 for the substrates 11 at a height which is substantially the same as the height of the substrate locations. This offers the advantage that the bondhead 10 is essentially at the same height when the second camera 15 has an image of the optical mark (s) 22 and possibly 23 or an image of the substrate locations or an image of substrate markings Records substrate. That the bondhead 10 does not have to be raised to different heights in order to bring the objects to be photographed into the plane of focus of the second camera 15.
    Pixel coordinates of the flipchip 3 are determined from the image of the flipchip 3 recorded by the first camera 14 and converted into machine coordinates of the bondhead 10 with the aid of first geometry data. The first
    CH 711 536 B1
    Geometry data include the position of the first optical marking 22 and a vector A with fixed values (u, v), which denotes the direction and distance from the first optical marking 22 to a reference point of the pixel coordinate system of the first camera 14. The first geometry data further comprise a fixed angle ψ, which describes the rotation between the pixel coordinate system of the first camera 14 and the machine coordinate system of the bondhead 10. If there is more than one optical marking, then the first geometry data comprise the position of each further optical marking and an assigned vector with fixed values, which denotes the direction and distance from the further optical marking to the reference point of the pixel coordinate system of the first camera 14.
    3 schematically shows the machine coordinate system MS of the bondhead 10, the pixel coordinate system PS of the first camera 14, the first optical marking 22, the vector A and the angle ψ. The values (u, v) of the vector A are numbers in the machine coordinate system MS.
    In the method according to the invention, as will be explained in detail below, the flip chip 3 is placed in the cavity 18, its bumps 1 being immersed in the flux, an image taken with the first camera 14, and after a wetting time has elapsed Flipchip 3 removed from the cavity 18 and mounted on the substrate 11. During this phase, the cavity 18 is located at a fixed location above the first camera 14 and the field of vision of the first camera 14 is directed toward the bottom of the cavity 18, so that the underside of the flip chip 3 with the bumps 1 appears in its image.
    In a first embodiment, the flux container 19 is arranged stationary. In this case, the device 13 comprises a drive for a back and forth movement of the plate 17. To fill the cavity 18 with flux, the plate 17 is moved so far that the cavity 18 is below the flux container 19 or on the opposite one Side of the flux container 19, and then moved back again, so that the cavity 18 is located at the above location above the first camera 14.
    In a second embodiment, the plate 17 is arranged in a stationary manner, the cavity 18 being located above the first camera 14. In this case, the device 13 comprises a drive for moving the flux container 19 from one side of the cavity 18 to the opposite side of the cavity 18. The flux container 19 slides on the plate 17 and fills the cavity 18 with flux.
    The second camera 15 is attached to the bond head 10. The optical axis of the camera 15 runs parallel to the gripping axis of the bonding head 10. The second camera 15 is mechanically attached to the bonding head 10 in such a way that the orientation of the pixel coordinate system associated with the images of the second camera 15 has a fixed geometric reference to the gripping axis of the bonding head 10 , The pixel coordinates of the substrate location, which are determined on the basis of at least one image of the substrate location recorded by the second camera 15 or of markings on the substrate, are converted into machine coordinates of the bondhead 10 with the aid of second geometry data.
    The second geometry data include a vector B with values (x, y), the direction and distance from a reference point of the pixel coordinate system of the second camera 15 to a reference point of the machine coordinate system of the bondhead 10. The second geometry data further comprise an angle φ, which describes the rotation of these two coordinate systems.
    The first and second geometry data further include scaling factors that enable the conversion of values in the pixel coordinate system of the respective camera into values in the machine coordinate system of the bondhead 10. The first and second geometry data are determined in a calibration phase that is carried out before the assembly phase. The calibration phase can be carried out at different times in order to increase the long-term stability of the device and the method.
    The described embodiments of the device are suitable for carrying out the method according to the invention for mounting the semiconductor chips as a flip chip on the substrate. The method according to the invention comprises the calibration phase mentioned above, in which the first and second geometry data are determined, and the assembly phase, in which the following steps are carried out for each semiconductor chip:
    either: with the wafer table 4 providing the semiconductor chip 2 at a predetermined location;
    with the pick-up head 6 of the flip device 5, removing the semiconductor chip 2 provided and rotating the semiconductor chip 2 by 180 ° in order to provide the semiconductor chip 2 as a flip chip 3;
    or: providing the semiconductor chip 2 as a flip chip with a feed device;
    with the transport head 8 taking over the flip chip 3 from the pick-up head 6 or the feed device;
    Filling the cavity 18 arranged in the plate 17 and formed with the transparent bottom with flux, the plate 17 either being arranged stationary or being moved after the cavity 18 has been filled, so that the cavity 18 is above the first camera 14 in both cases ;
    CH 711 536 B1
    Depositing the flipchip 3 in the cavity 18, the bumps 1 facing the bottom of the cavity 18;
    with the first camera 14 taking an image of the flip chip 3 and determining an actual position of the flip chip 3 with respect to a machine coordinate system of the bonding head 10 on the basis of the image and the first geometry data;
    with the bonding head 10 removing the flip chip 3 from the cavity 18;
    Determining an actual position of the substrate location in relation to the machine coordinate system of the bondhead 10 either by:
    Moving the bondhead 10 to a position above the substrate location, in which the substrate location is in the field of view of the second camera 15, with the second camera 15 taking at least one image, and
    Calculating the actual position of the substrate space based on the position of the substrate space in the at least one image and the second geometry data;
    or by:
    Calculating the actual position of the substrate space using actual positions of at least two substrate markings, the actual position of each of the at least two substrate markings being determined in each case after a new substrate 11 has been fed to the support 12 by:
    Moving the bondhead 10 to a position above the substrate 11, in which the substrate marking is in the field of view of the second camera 15, with the second camera 15 taking an image, and
    Determining the actual position of the substrate marking on the basis of the image and the second geometry data; and
    Calculating the position to be approached by the bondhead 10 on the basis of the determined actual position of the flip chip 3 and the determined actual position of the substrate space; and
    Moving the bondhead 10 to the calculated position and placing the flipchip 3 on the substrate location.
    The equipment of the device with the transport head 8, which takes over the flip chip 3 from the pick-up head 6 or the feeder and placed in the cavity 18, and with the bonding head 10, which takes the flip chip 3 out of the cavity 18 and placed on the substrate 11 enables an increase in the throughput of the device, because the transport head 8 and the bonding head 10 largely simultaneously, ie can work in parallel. The control device is set up to control the movements of the transport head 8 and of the bonding head 10 in such a way that the two heads are at least partially in motion simultaneously without colliding with one another. With regard to the highest possible throughput of the device, the control device is programmed in particular to control the sequence of the individual steps of the method in such a way that the transport head 8 moves the subsequent flip chip 3 as quickly as is possible due to the duration of the individual process steps Cavity 18 settles after the bondhead 10 has removed the flipchip 3 to be mounted next from the cavity 18.
    1 shows the device at a time at which the pick-up head 6 of the flip device 5 has removed a semiconductor chip 2 from the wafer table 4, a flip chip 3 is placed in the cavity 18, and the bond head 10 one flip chip 3 wetted with flux is transported to substrate 11.
    The image of the flip chip 3 recorded by the first camera 14 can also be used to check, in addition to determining the actual position of the flip chip 3, whether all the bumps 1 are present and / or are properly wetted. In addition, the first camera 14 can record one image after the other of the flip chip 3, the image processing software can evaluate the image and check whether all the bumps 1 are properly wetted, and as soon as this is the case, can issue a message that the bondhead 10 has the flip chip 3 immediately removed from the cavity 18 and placed on the substrate space.
    If the viewing angle of the second camera 15 is relatively small, so that there is not enough space for the entire substrate space in the image, then the bonding head 10 is advantageously moved to different positions and an image is recorded at each position which contains a part of the substrate space. The position and orientation of the substrate space are then determined on the basis of these images.
    In a first production mode, the position of the substrate location on which the flip chip is to be placed is determined on the basis of at least one image of the substrate location. In a second production mode, once a new substrate has been fed in, the position of the substrate marks is determined once and the individual target positions of the flip chips are then calculated using geometric material data. Such an application
    CH 711 536 B1 is “wafer level packaging” (WLP), in which the substrate is a plastic-coated wafer. The wafer does not contain any position markings of the individual substrate locations, but rather substrate markings which are attached near the edge of the wafer.
    In order, for example, to exclude positioning errors of the flip chip 3 on the substrate space caused by temperature changes, the position of the first optical marking 22 is determined in the calibration phase and updated at one or more predetermined times by:
    Moving the bondhead 10 to a position in which the first optical marking 22 is in the field of view of the second camera 15;
    taking a picture with the second camera 15;
    Determining the position of the first optical marker 22 based on the image and the second geometry data; and
    Saving the determined position as the new position of the first optical marking 22.
    The invention thus makes use of the knowledge that one or more optical markings which are / are applied to the camera carrier 16 on which the first camera 14 is attached are sufficient to take the influence of changes between the pixel coordinate system of the first into account Camera 14, the pixel coordinate system of the second camera 15 and the machine coordinate system of the bondhead 10 to reduce the positioning of the flip chip 3 on the substrate space to a level given by the requirements of today.
    If one or more further optical markings are present, for example the optical marking 23, then the position of the further optical marking (s) is determined in the same way in the calibration phase and updated at the times mentioned.
    Advantageously, there are two pick-and-place systems, each with a flip device 5 with a pick-up head 6, a first transport system 7 with a transport head 8, a second transport system 9 with a bond head 10, a device 13 for wetting a flip chip with flux, as well as a first camera 14 and a second camera 15, which alternately fetch a semiconductor chip 2 from the wafer table 4 and mount it alternately as a flip chip 3 on the substrate 11 provided on the support 12.
    The method according to the invention offers the following advantages:
    - Placing the flip chip in the cavity at the same location as removing the flip chip from the cavity ensures that the distribution of the flux in the cavity is not changed by movements of the cavity from a first location to a second location and that the flip chip changes in the cavity does not shift, which could have an adverse effect on the wetting of the bumps of the flip chip or lead to a reduction in the throughput of the device.
    - The duration during which the bumps of the flip chip are immersed in the flux can be set independently of the other process steps. This is important in order to achieve optimal wetting of the bumps of the flip chip and the highest possible throughput.
    - The equipment with transport head and bond head and the simultaneous, parallel operation of transport head and bond head increases the throughput of the device.
    权利要求:
    Claims (4)
    [1]
    claims
    1. A method for the assembly of bumps (1) provided with semiconductor chips (2) on substrate locations of a substrate (11), in which first and second geometry data are determined in a calibration phase and in the following steps in an assembly phase for each semiconductor chip (2) be performed:
    either: with a wafer table (4) providing the semiconductor chip (2) at a predetermined location;
    with a pick-up head (6) of a flip device (5) removing the semiconductor chip (2) provided and rotating the semiconductor chip (2) through 180 ° in order to provide the semiconductor chip (2) as a flip chip (3);
    or: providing the semiconductor chip (2) as a flip chip (3) with a feed device;
    with a transport head (8) taking over the flip chip (3) from the pick-up head (6) or the feed device;
    Filling a cavity (18) arranged in a plate (17) and formed with a transparent bottom with flux, the plate (17) either being arranged stationary or being moved after the cavity (18) has been filled, so that the cavity (18 ) in both cases above a first camera (14) which is arranged in a fixed position; Depositing the flip chip (3) in the cavity (18), the bumps (1) facing the bottom of the cavity (18);
    with the first camera (14) recording an image of the flip chip (3) and determining an actual position of the flip chip (3) with respect to a machine coordinate system of a bonding head (10) on the basis of the image and the first geometry data;
    with the bonding head (10) removing the flip chip (3) from the cavity (18);
    CH 711 536 B1
    Determining an actual position of the substrate location in relation to the machine coordinate system of the bondhead (10) with the aid of a second camera (15) which is attached to the bondhead (10), either by:
    Moving the bonding head (10) to a position above the substrate location in which the substrate location is in the field of view of the second camera (15) with the second camera (15) taking at least one image and calculating the actual position of the substrate location based on the location the substrate location in the at least one image and the second geometry data;
    or by:
    Calculating the actual position of the substrate space using actual positions of at least two substrate markings, the actual position of each of the at least two substrate markings being determined in each case after a new substrate (11) has been fed to the support (12) by:
    Moving the bondhead (10) to a position above the substrate in which the substrate marking is in the field of view of the second camera (15) with the second camera (15) taking an image, and
    Determining the actual position of the substrate marking on the basis of the image and the second geometry data; and calculating a position of the bondhead (10) to be approached on the basis of the determined actual position of the flipchip (3) and the actual position of the substrate space; and
    Moving the bonding head (10) to the calculated position and placing the flip chip (3) on the substrate location, the transport head (8) and the bonding head (10) being at least partially in motion at the same time.
    [2]
    2. The method of claim 1, wherein the first geometry data comprises a position of a first optical marker (22) and a first fixed vector, the direction and distance from the first optical marker (22) to a reference point of a pixel coordinate system of the first camera (14 ), and at which the position of the first optical marking (22) is updated at least at a predetermined time by: moving the bonding head (10) to a position in which the first optical marking (22) is in the field of view of the second camera (15 ) is;
    taking a picture with the second camera (15);
    Determining the position of the first optical marking (22) on the basis of the image and the second geometry data; and
    Saving the determined position as the new position of the first optical marking (22).
    [3]
    3. The method according to claim 2, wherein the first geometry data comprise a position of at least one further optical marking (23) and a further fixed vector, the direction and distance from the further optical marking to the reference point of the pixel coordinate system of the first camera (14) , and at which the position of the further optical marking (23) is updated by moving the bonding head (10) to a position in which the further optical marking (23) is in the field of view of the second camera (15) ;
    taking a picture with the second camera (15);
    Determining the position of the further optical marking (23) on the basis of the image and the second geometry data; and
    Saving the determined position as the new position of the further optical marking (23).
    [4]
    4. The method according to claim 2 or 3, wherein the optical marking (s) is / are covered by the plate (17) when the cavity (18) of the plate (17) is in the position above the first camera (14), the method further comprises moving the plate (17) into a position in which the optical mark (s) (22, 23) is / are exposed before the position (s) of the optical (n ) Mark (s) (22, 23) will be updated.
    CH 711 536 B1
    TF7
    CH 711 536 B1
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    法律状态:
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